ceramic-knife
Inner Hole Lapping Equipment
Hole Lapping Automatic Processing Equipment
Hole Lapping Automatic Processing Equipment
Core Function: Ultra-high precision inner hole grinding, ensuring bonding process stability, adapting to micron-level processing requirements.
Equipment Advantages: Fully automatic capillary loading/unloading, tail positioning, tungsten wire expanding stations - multi-station parallel operation significantly reducing cycle time.
Fully automatic capillary loading/unloading, tail positioning, tungsten wire expanding stations - multi-station parallel operation\nDual expanding stations, single station capacity 2~3 um, total 4~6 um\nHole tolerance after expanding: +/-1 um; with imported wire: +/-0.5 um\nAvg cycle time: 40~60 sec\nSingle wire processes 300+ times
| Core Function | Ultra-high precision inner hole grinding |
| Expanding Stations | Dual station design |
| Single Station Capacity | 2~3 um |
| Total Capacity | 4~6 um |
| Hole Tolerance | +/-1 um (imported wire: +/-0.5 um) |
| Avg Cycle Time | 40~60 sec |
| Wire Life | 300+ processes per wire |
RECOMMENDED PRODUCTS
